Template is for the holding of wafers by water film tension instead of by wax,compared with way of holding wafers by wax, using templates to hold wafer is ofhigher efficiency and lower production cost. The pocket of templates can bemade into various of shapes and depth for the holding of specific parts.
To control thegeometry precidion of polished wafers,templates are often adheredonto a ceramic plate with its PSA backtape. Corrensponding to materials of wafers and charactristics of slurries,different types of backing films can be choosed.For the polishing of Si wafer , sapphire wafers, it is recommended to use opencell backing film, while for the polishing of GaAs,InP,CZT etc where the polishing slurry is more corrosive, close cell backing film isrecommended.
